About TI
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!

About the job
A Bump Process Development Engineer is responsible for the development, characterization and optimization of Bump technologies.  The ideal candidate will be a technical leader in the area of Bump processes to ensure sucess robustness, reliability, and manufacturability meeting all electrical device performance targets for these new technologies.  Analog is a growth area for TI. As a member of our packaging team, you’ll have the chance to interact with many product groups and functions. You’ll have high visibility on your projects, with strong opportunities for growth both within our team and across the Analog organization.
 
Responsibilities include:
– Support next generation bump and WCSP designs for improved performance, cost reduction and reliability.  Extensive clean room time will be required to develop new processes for the next gen technologies.
– Engaging with multiple internal and external stakeholders to guide and execute on technology roadmaps to support future products
– Working with individuals and teams across broad geographical and organizational boundaries
– Support of business, customer, manufacturing and quality partners
– Peer training and mentoring.

The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.

Minimum requirements:
– Mechanical, Electrical or Chemical Engineering background or Material Sciences (minimum BS degree)
– 5+ years experience in bump manufacturing.  Must have detailed experience and knowledge of bump wet etch and electroplating processes

Preferred qualifications:
– Track record of development work leading to volume production for bump processing.
– Knowledge of bump materials and integration.
– Understanding of basic WCSP, Flip Chip and Wire Bond bump processing including FMEA’s and the relationship between bump and package.
– Multi-functional team leadership, multi-site project management

To be considered for this position, please apply.